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MY-CAM004M Camera Module (1)

MY-CAM005M Camera Module (1)

MY-WIREDCOM RPI Module (1)

MY-SODIMM200 Socket (1)

Discontinued Products

MYC-C7Z010/20 (Zynq-7010/20) (1)

MYC-Y7Z010/20 (Zynq-7010/20) (1)

MCC-SAMA5D3X-C (Atmel A5D3) (1)

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MYC-Exynos4412 (Samsung) (1)

MYC-S5PV210 (Samsung S5PV210) (1)

MYD-CZU3EG/4EV/5EV (Xilinx) (1)

VECP Starter Kit (Xilinx ZU3EG) (1)

MYD-Y6ULX-CHMI (i.MX 6UL/6ULL) (1)

MYD-Y6ULX-HMI (i.MX 6UL/6ULL) (1)

MYD-IMX28X (NXP i.MX28) (1)

MYD-LPC185X (NXP LPC185x) (1)

MYD-LPC435X (NXP LPC435x) (1)

MYD-LPC1788 (NXP LPC1788) (1)

MYD-SAM9X5-V2 (Atmel SAM9X5) (1)

MYD-SAM9X5 (Atmel SAM9X5) (1)

MYD-JA5D2X (Atmel A5D2) (1)

MYD-SAMA5D3X-C (Atmel A5D3) (1)

MYD-SAMA5D3X (Atmel A5D3) (1)

MYD-JA5D4X (Atmel A5D4) (1)

MYS-8MMX (NXP i.MX 8M Mini) (1)

MYS-S5PV210 (Samsung S5PV210) (1)

MYS-SAM9G45 (Atmel SAM9G45) (1)

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MY-WF004S SDIO WiFi Module (1)

MY-UART012U Convertor (1)

MYD-Y7Z010/20 IO Cape (1)

MYB-Y6ULX-HMI-4GEXP (1)

MY-EVC5100S-HMI (TI AM335x) (1)

          Products >  System-On-Modules (SOMs) >  MYC-LD25X (ST STM32MP257) > MYC-LD25X System-On-Module
 
MYC-LD25X System-On-Module

MYC-LD25X System-On-Module

- ST STM32MP257D Processor based on 1.5GHz Dual ARM Cortex-A35 and 400MHz Cortex-M33 Cores
- Neural Processing Unit (NPU) operating at up to 1.35 TOPS, 3D GPU
- 1GB/2GB LPDDR4, 8GB eMMC, 256Kbit E2PROM
- STPMIC25APQR Power Management IC
- 252-pin Expansion Interface with LGA Package
- Supports Working Temperature Ranging from -40°C to 85°C
- Supports for Linux and Debian OS
 

MYIR is an ST Authorized Partner, welcome to use MYIR's ST series products!
We also offer ODM and OEM services, welcome your inquiry!

https://www.myirtech.com/stseries.asp



The MYC-LD25X is a robust and compact System-On-Module (SoM), measuring 37mm by 39mm, designed around the ST STM32MP257D processor. This advanced module incorporates a dual-core ARM Cortex-A35 processor operating at up to 1.5GHz and a 400MHz Cortex-M33 core, offering a high-performance solution tailored for industrial applications. It also features an NPU with up to 1.35 TOPS for advanced edge AI capabilities and a 3D GPU, as well as H.264 encoding/decoding support, thus delivering powerful multimedia and artificial intelligence processing capabilities.


Harnessing the capabilities of the STM32MP257D processor, the MYC-LD25X incorporates a power management IC (PMIC) STPMIC25APQR, 1GB or 2GB LPDDR4 memory, 8GB eMMC storage, and a 256Kbit EEPROM.  It provides extensive peripheral and I/O connectivity via a 252-pin LGA package, featuring 3 Ethernet ports, 3 FDCAN interfaces and LVDS/DSI display interfaces, making it suitable for a wide range of applications, including industrial HMI, edge computing gateways, energy storage systems, new energy charging stations, and industrial automation.


MYC-LD25X Top-view and Bottom-view


The MYC-LD25X supports Linux 6.1 and Debian 12 operating systems, ensuring flexibility and adaptability for various project requirements. MYIR provides a comprehensive software bundle, including kernel and driver source codes, along with compilation tools, are available to facilitate a smooth development process from initial design to final implementation.


The MYD-LD25X development board, based on the MYC-LD25X SOM, provides a wide range of peripherals via the SOMs 252-pin LGA expansion interface. This includes 2x USB 2.0 Host, 1x USB 2.0 OTG, 3x Gigabit Ethernet, a Micro SD card slot, and an integrated WiFi/Bluetooth module. It supports LVDS and HDMI display outputs, incorporates a MIPI-CSI interface, and offers an audio interface. Furthermore, the board features a 2*20-pin RPI extension interface, enabling access to additional resources such as GPIO, I2C, UART, SPI, and CAN. MYIR provides optional add-ons such as the MY-LVDS070C 7-inch LCD Module, MY-CAM003M Camera Module, and MY-WIREDCOM RPI Module, which enhance functionality and versatility.



Top-view of MYD-LD25X Development Board



Bottom-view of MYD-LD25X Development Board

Features

Mechanical Parameters

  • Dimensions: 39mm x 37mm
  • PCB Layers: 12-layer design
  • Power supply: 5V/3A
  • Working temperature: -40~85 Celsius (industrial grade)

Processor

  • STMicroelectronics STM32MP257D Processor (STM32MP257DAK3)
    - Dual-core Arm Cortex-A35 64-bit RISC core operating at up to 1.5 GHz
    - A Cortex-M33 32-bit RISC core operating at up to 400 MHz
    - Neural Processing Unit (NPU) operating at up to 1.35 TOPS and 3D GPU
    - H.264 encoding/decoding

Memory

  • 1GB/2GB LPDDR4
  • 8GB eMMC
  • 256Kbit EEPROM

Peripherals and Signals Routed to Pins

  • Power Management IC (STPMIC25APQR)
  • 252-pin LGA expansion interface
    - 3x RGMII
    - 1x USB 2.0 Host
    - 1x USB 3.0 OTG
    - 4x USART
    - 5x UART
    - 8x SPI
    - 7x I2C
    - 4x I3C
    - 3x CAN FD
    - 2x SD/MCC
    - 4x SAI
    - 1x Parallel RGB
    - 1x MIPI DSI
    - 2x LVDS
    - 1x MIPI CSI
    - 1x DCMI
    - 1x JTAG
    - 1x SWD
    - Up to 128 GPIOs

Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and SOM pin-out description file.

OS Support

  • Linux 6.1
  • Debian 12

Other MYIR's ST Products

http://www.myirtech.com/stseries.asp

MYD-YA15XC-T Development Board (MYC-YA15XC-T as core board, STM32MP151)

MYD-YA157C-V3 Development Board (MYC-YA157C-V3 as core board, STM32MP157)

MYD-YF13X Development Board (MYC-YF13X as core board, STM32MP135)



Hardware Specification

The MYC-LD25X System-on-Module (SOM) mounted on the MYD-LD25X Development Board uses the 14 x 14mm, 0.5mm ball pitch, 424-ball VFBGA packaged 1.5 GHz ST STM32MP257D microprocessor (STM32MP257DAK3). This processor belongs to the ST STM32MP25xA/D product line, which features a dual-core Arm Cortex-A35 (operating at up to 1.5 GHz) and a single-core Arm Cortex-M33 (running at up to 400 MHz). Additionally, it includes a neural processing unit (NPU) with 1.35 TOPS and a 3D graphics processing unit (GPU). The processor is further enhanced with an integrated video encoder and decoder. A rich set of interfaces is supported by the processor, such as three Ethernet ports with switch and TSN capabilities, FD-CAN, PCIe/USB3.0, and others. It also supports Parallel and MIPI CSI-2 for camera connections and Parallel, LVDS, and MIPI DSI for display connectivity. These features make STM32MP25xA/D devices well-suited for a wide range of consumer, industrial, white goods and medical applications.



STM32MP257 Application Processors


STM32MP257 Circuit Diagram


MYC-LD25X Function Block Diagram




Software Features

The MYD-LD25X development board supports Linux 6.1 and Debian 12 OS, and comes with comprehensive software packages. To assist clients in accelerating their projects, the kernel and various peripheral drivers are provided in source code format. Here is a brief overview of the key software features:

Item

Features

Features

Source Code

Bootloader

TFA

First bootloader 2.8.15

YES

U-boot

The second boot program uboot_2022.10

YES

Linux kernel

Linux kernel

Customized based on official kernel_6.1.82 version

YES

Device driver

EEPROM

BL24C256A driver

YES

USB Host

USB Host driver

YES

USB OTG

USB OTG driver

YES

I2C

I2C bus driver

YES

SPI

SPI bus driver

YES

Ethernet

YT8531SH-CA driver

YES

LVDS

LVDS display driver

YES

HDMI

LT9611 driver

YES

Audio

ES8388 Audio Driver

YES

MIPI CSI

OV5640

YES

RTC

LK8563T driver

YES

GPIO

General purpose GPIO driver

YES

UART

RS232/RS485 driver

YES

CAN

CAN driver

YES

WiFi

AP6256 driver

YES

BT

AP6256 driver

YES

File system

myir-image-core

Image without GUI interface built with Yocto that supports rt Linux

YES

myir-image-full

A fully functional QT and HMI image built with Yocto

YES

myir-image-debian

Image built with debian system

YES




Relative Download and Links

You can download relative chip datasheet, products datasheet, user manual, software package from below. Detailed technical data available on request.


1 MYC-LD25X System-On-Module Overview 1.22 MB
2 MYD-LD25X Development Board Overview
1.44 MB
3 MYC-LD25X Pinouts Description
80 KB
4 3D STEP file of MYC-LD25X
6.30 MB

MYD-LD25X Development Board



MYC-LD25X System-On-Module (Top-view and Bottom-view)




Price and Ordering


Item

Part No.

Packing List

Unit Price

Ordering

MYC-LD25X
System-On-Module
MYC-LD257-8E1D-150-I
(1GB LPDDR4, 8GB eMMC)


One MYC-LD25X SOM


USD43.80

MYC-LD257-8E2D-150-I

(2GB LPDDR4, 8GB eMMC)

USD49.80

MYD-LD257-8E1D-150-I
(1GB LPDDR4, 8GB eMMC)

- One MYD-LD25X board

(including MYC-LD25X)
- One USB-to-TTL cable
- One Quick Start Guide
USD75

MYD-LD257-8E2D-150-I

(2GB LPDDR4, 8GB eMMC)

USD81
MY-WIREDCOM
RPI Module for extension
of RS232/RS485/CAN
USD18

MY-CAM003M
MIPI Camera Module USD25

MY-LVDS070C
7-inch LCD Module
with capacitive touch screen
USD99
Note:

1. One MYD-LD25X Development Board comprises one MYC-LD25X SOM mounted onto the base board. If you require additional SOMs, you may place order for extras.


2. Bulk discounts are available. For inquiries, kindly contact MYIR.

3. We cater to custom design requests based on the MYD-LD25X, whether it involves reducing, adding or modifying the existing hardware components to suit the customers' specific needs.