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We also offer ODM and OEM services, welcome your inquiry!
https://www.myirtech.com/stseries.asp
The MYC-LD25X is a robust and compact System-On-Module (SoM), measuring 37mm by 39mm, designed around the ST STM32MP257D processor. This advanced module incorporates a dual-core ARM Cortex-A35 processor operating at up to 1.5GHz and a 400MHz Cortex-M33 core, offering a high-performance solution tailored for industrial applications. It also features an NPU with up to 1.35 TOPS for advanced edge AI capabilities and a 3D GPU, as well as H.264 encoding/decoding support, thus delivering powerful multimedia and artificial intelligence processing capabilities.
Harnessing the capabilities of the STM32MP257D processor, the MYC-LD25X incorporates a power management IC (PMIC) STPMIC25APQR, 1GB or 2GB LPDDR4 memory, 8GB eMMC storage, and a 256Kbit EEPROM. It provides extensive peripheral and I/O connectivity via a 252-pin LGA package, featuring 3 Ethernet ports, 3 FDCAN interfaces and LVDS/DSI display interfaces, making it suitable for a wide range of applications, including industrial HMI, edge computing gateways, energy storage systems, new energy charging stations, and industrial automation.
MYC-LD25X Top-view and Bottom-view
The MYC-LD25X supports Linux 6.1 and Debian 12 operating systems, ensuring flexibility and adaptability for various project requirements. MYIR provides a comprehensive software bundle, including kernel and driver source codes, along with compilation tools, are available to facilitate a smooth development process from initial design to final implementation.
The MYD-LD25X development board, based on the MYC-LD25X SOM, provides a wide range of peripherals via the SOM’s 252-pin LGA expansion interface. This includes 2x USB 2.0 Host, 1x USB 2.0 OTG, 3x Gigabit Ethernet, a Micro SD card slot, and an integrated WiFi/Bluetooth module. It supports LVDS and HDMI display outputs, incorporates a MIPI-CSI interface, and offers an audio interface. Furthermore, the board features a 2*20-pin RPI extension interface, enabling access to additional resources such as GPIO, I2C, UART, SPI, and CAN. MYIR provides optional add-ons such as the MY-LVDS070C 7-inch LCD Module, MY-CAM003M Camera Module, and MY-WIREDCOM RPI Module, which enhance functionality and versatility.
Top-view of MYD-LD25X Development Board
Bottom-view of MYD-LD25X Development Board
Features
Mechanical Parameters
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Dimensions: 39mm x 37mm
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PCB Layers: 12-layer design
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Power supply: 5V/3A
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Working temperature: -40~85 Celsius (industrial grade)
Processor
Memory
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1GB/2GB LPDDR4
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8GB eMMC
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256Kbit EEPROM
Peripherals and Signals Routed to Pins
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Power Management IC (STPMIC25APQR)
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252-pin LGA expansion interface
- 3x RGMII
- 1x USB 2.0 Host
- 1x USB 3.0 OTG
- 4x USART
- 5x UART
- 8x SPI
- 7x I2C
- 4x I3C
- 3x CAN FD
- 2x SD/MCC
- 4x SAI
- 1x Parallel RGB
- 1x MIPI DSI
- 2x LVDS
- 1x MIPI CSI
- 1x DCMI
- 1x JTAG
- 1x SWD
- Up to 128 GPIOs
Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and SOM pin-out description file.
OS Support
Other MYIR's ST Products
http://www.myirtech.com/stseries.asp
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MYD-YA157C-V3 Development Board (MYC-YA157C-V3 as core board, STM32MP157)
MYD-YF13X Development Board (MYC-YF13X as core board, STM32MP135)
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