MYIR is an ST Authorized Partner, welcome to use MYIR's ST series products!
We also offer ODM and OEM services, welcome your inquiry!
https://www.myirtech.com/stseries.asp
Measuring only 37mm by 39mm, the MYC-YF13X CPU Module is a compact System-on-Module (SoM) based on ST STM32MP135 processor (STM32MP135DAF7) which among the STM32MP1 series MPUs and features 1GHz single ARM Cortex-A7 core. It has onboard DDR3L, Nand Flash or eMMC, and 32Kbit EEPROM. A variety of peripheral and IO signals are brought out through the 1.0 mm pitch 148-pin stamp-hole (Castellated-Hole) expansion interface. With high reliability, extensive peripheral resources and low cost, the MYC-YF13X can be used in a wide range of applications such as energy power, industrial control, industrial gateway, industrial HMI, and more others.
MYC-YF13X CPU Module Top-view and Bottom-view (delivered with shielding cover installed by default)
The MYC-YF13X CPU Module is capable of running Linux 5.15 OS. MYIR provides image files, kernel and driver source codes, application demos and compilation tools to enable users to start their development rapidly and easily.
The MYD-YF13X Development Board is provided for evaluating and prototyping based on STM32MP13X series microprocessors. It is built around the MYC-YF13X CPU Module and has brought out a rich set of peripherals and interfaces to the base board including RS232, RS485, two USB 2.0 HOST and one USB 2.0 OTG, two Gigabit Ethernet, CAN, one Micro SD card slot, one USB based Mini-PCIe 4G Module interface with one SIM card holder, LCD interface, Camera interface, Audio input and output as well as two extension headers. It is delivered with Quick Start Guide, one USB to TTL serial cable, one 12V/2A Power adapter and one DC Power jack adapter to help users start up the development right away out-of-the-box. MYIR also offers MY-LCD70TP-C LCD Module, MY-CAM011B Camera Module and MY-RGB2HDMI Module as the options for the board.
MYD-YF13X Development Board (Top-view)
MYD-YF13X Development Board (Bottom-view)
Features
Mechanical Parameters
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Dimensions: 39mm x 37mm
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PCB Layers: 10-layer design
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Power supply: 5V/1A
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Working temperature: -40~85 Celsius (industrial grade)
Processor
Memory
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256/512MB DDR3L
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256MB Nand FLASH/4GB eMMC
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32Kbit EEPROM
Peripherals and Signals Routed to Pins
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1.0mm pitch 148-pin stamp hole expansion interface
- 2 x RGMII
- 2 x USB2.0
- 8 x UART
- 2 x SCI
- 2 x CAN FD
- 4 x I2S
- 5 x I2C
- 2 x ADC
- 1 x RGB
- 1 x Parallel Camera
- 2 x SAI
- Up to 108 GPIOs
Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file.
OS Support
Other MYIR's ST Products
http://www.myirtech.com/stseries.asp
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MYD-YA157C Development Board (MYC-YA157C CPU Module as core board, STM32MP157)
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Overview
