Measuring 45mm by 82mm, the MYC-JD9360 CPU Module is a powerful embedded ARM SoM based on SemiDrive’s 1.6GHz D9-Pro six-core Arm Cortex-A55 smart industrial processor with one real-time Cortex-R5 co-processor. The D9-Pro provides dedicated AI capabilities with integrated NPU, high-performance 3D graphics processing capabilities with Imagination's PowerVR 9XM GPU, high-resolution image processing capabilities with a pretty fast VPU, and an extensive set of peripherals such as PCIe3.0, USB3.0, Gigabit Ethernet, CAN-FD, UART, SPI, etc.
The MYC-JD9360 CPU Module has integrated D9-Pro processor, 2GB LPDDR4, 16GB eMMC Flash, 16MB SPI Nor Flash, 256Kbit EEPROM and power IC. A number of peripheral and IO signals are access through one 0.5mm pitch 314-pin MXM 3.0 gold-finger-edge-card connector. It is especially suitable for high performance display control machine, industrial robot, construction machinery T-BOX, smart cockpit, car entertainment, intelligent medical equipment and more other applications.
MYC-JD9360 CPU Module (Top-view)
MYC-JD9360 CPU Module (Bottom-view)
MYIR provides complete software package for Linux, Ubuntu and Android operations systems running on the MYC-JD9360 CPU Module to help users launch their development quickly and easily.
The MYD-JD9360 Development Board is built around the MYC-JD9360 CPU Module to serve as a complete development platform for evaluation or prototyping purposes. Its base board provides rich communication interfaces such as two RS232, two RS485, two USB3.0 HOST and one USB2.0 OTG, two TSN enabled Gigabit Ethernet, two CAN, one Micro SD card slot, one SDIO/UART based WiFi/BT module, one M.2 Socket for USB3.0 based 4G/5G LTE Module with one SIM card holder and one M.2 Socket for PCIE3.0 based SSD module. The board has also implemented advanced multi-media capabilities of D9-Pro to support HDMI, LVDS, MIPI CSI and Audio. MYIR offers MY-CAM003M MIPI Camera Module and MY-LVDS070C LCD Module as options for the MYD-JD9360 board which allows customers to acquire better development experience.
MYD-JD9360 Development Board (Top-view)
MYD-JD9360 Development Board (Bottom-view)
Features
Mechanical Parameters
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Dimensions: 82mm x 45mm
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PCB Layers: 8-layer design
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Power supply: 5V/5A
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Working temperature: -40~85 Celsius (industrial grade)
Processor
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SemiDrive D9-Pro Processor (D9360)
- 6*Cortex-A55@1.6GHz
- 1*Cortex-R5@800MHz, dual-core Lock-step
- IMG PowerVR 9XM GPU, 100GFLOPS
- VPU H.264 Video Encoder/Decoder, H.265/VP8/VP9 Video Decoder
- 0.8Tops NPU (SemiDrive SlimAI Engine)
Memory
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2GB LPDDR4 (supports up to 4GB)
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16GB eMMC (supports up to 128GB)
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256Kbit EEPROM
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16MB QSPI Nor Flash
Peripherals and Signals Routed to Pins
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0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
- 2 x Gigabit Ethernet
- 2 x PCIe3.0
- 2 x USB3.0 (DRD)
- 2 x SDIO
- 11 x UART (supports up to 16 x UART)
- 2 x CAN-FD (supports up to 4 x CAN-FD)
- 4 x I2C (supports up to 12 x I2C)
- 2 x SPI (supports up to 8 x SPI)
- 4 x 12bit ADC
- 1 x MIPI-DSI
- 2 x LVDS
- 1 x Parallel CSI
- 1 x MIPI CSI
- 4 x Single-channel I2S/TDM
- 2 x Multi-channel I2S
- 1 x JTAG
- Up to 135 x GPIOs
Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet.
OS Support
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Linux 4.14
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Ubuntu 18.04
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Android 10 (coming soon)
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Overview
