MYD-C335X-GW Development Board

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The MYD-C335X-GW Development Board consists of a high-performance CPU Module MYC-C335X-GW and a base board designed especially for gateway applications. It’s a complete development platform for both evaluation and application development purposes based on TI AM335x ARM Cortex-A8 processors.

As the controller board of the MYD-C335X-GW, the MYC-C335X-GW CPU Module integrates an up to 1GHz AM335x processor (15x15mm ZCZ package, 800MHz AM3354 by default), 256MB/512MB DDR3L, 4GB eMMC Flash/256MB Nand Flash, 256Kbit EEPROM and PMIC. It is mounted on the top of the base board via two 0.8mm pitch 80-pin Board-to-Board expansion connectors. The base board provides a good showcase of the CPU Module’s connectivity features and performance, rich peripherals are routed out including RS232, RS485, USB 2.0 Host, 2 x Ethernet (or 1 x Ethernet and 1 x SFP interface), Micro SD card slot, WiFi/Bluetooth module, LVDS, LCD and JTAG as well as a Mini PCIe interface for USB based 4G LTE module. The board is delivered with necessary cable accessories. Optional Camera module and LCD modules are also available for the board.

MYD-C335X-GW Development Board


MYC-C335X-GW CPU Module

The MYD-C335X-GW is ready to run Linux. Based on Linux 4.14.67 kernel, MYIR has provided abundant software resources including kernel and driver source code as well as MYIR’ s MEasy IOT Demo to allow customer to get a good experience and development reference.

MYD-C335X-GW in the Video

- Unboxing MYD-C335X-GW Development Kit Based on TI AM335x ARM Cortex A8 processor

Features

Mechanical Parameters

• Dimensions: 112.57mm x 132mm (base board), 50mm x 40mm (CPU Module)
• PCB Layers: 4-layer design (base board), 8-layer design (CPU Module)
• Supply voltage: 4.75-5.25V (CPU Moudule)
• Working temperature: -40~85 Celsius (industrial grade)

The MYD-C335X-GW Controller Board (MYC-C335X-GW CPU Module)

MYC-C335X-GW Top-view                                                 MYC-C335X-GW Bottom-view

Processor

• TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (pin-to-pin compatible, 15 x15mm, 0.8-mm ball pitch, ZCZ packge)
  - NEON™ SIMD Coprocessor
  - 32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection (parity)
  - 256KB of L2 Cache with Error Correcting Code (ECC)
  - SGX530 Graphics Engine
  - Programmable Real-Time Unit Subsystem

Memory

• 256/512MB DDR3L (supports up to 1GB)
• 256MB Nand Flash (supports optional 512MB/1GB)
• 4GB eMMC (alternative design with Nand Flash)
• 256Kbit EEPROM
  

Peripherals and Signals Routed to Pins

• Power Management IC (TPS65217C)
• Two 0.8mm pitch 80-pin expansion connectors can carry out interfaces below
  - 2 x RGMII
  - 2 x USB2.0 Host or 2 x USB2.0 Device
  - 6 x UART
  - 3 x I2C
  - 2 x CAN
  - 2 x SPI
  - 7 x ADC
  - 1 x SAI
  - 1 x RGB (supports RGB888 at up to 2048 x 2048 pixels resolution)
  - 2 x SDIO
  - 1 x JTAG
  - 97 x GPIOs

Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file.

The MYD-C335X-GW Base Board

• Serial ports
- 1 x Debug serial port (TTL)

- 1 x RS485 serial port (with isolation)

- 1 x 3-wire RS232 serial port (with isolation)

• 1 x USB2.0 Host port
• 1 x Mini-PCIe interface (for USB based 4G LTE Module)
• 2 x Gigabit Ethernet interfaces or 1 x Gigabit Ethernet interface and 1 x SFP interface
• WiFi/Bluetooth Module (complies with IEEE 802.11 b/g/n and supports Bluetooth V4.1+HS)
• 1 x RGB LCD interface (J14)
• 1 x LVDS LCD interface (J15, 40-pin FPC connector)
  
• Battery backed RTC (on the back of the board)
• 1 X JTAG interface (2.54mm pitch 2*7-pin header)
• 1 x ADC interface
• 1 x TF card slot
• 1x SIM card slot
• 2 x external antenna connector (one for WiFi module and one for 4G LTE module)
• 1 x 2.54mm 2*10-pin male expansion header (J22)

OS Support

• Linux 4.14.67

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