MYC-C335X-GW CPU Module

MYIR is a thrid party Partner of TI, welcome to use MYIR's TI series products!
We also offer ODM & OEM services, welcome your inquiry!
https://www.myirtech.com/tiseries.asp

Measuring only 50mm by 40mm, the MYC-C335X-GW is the fourth AM335x CPU Module designed by MYIR especially for gateway applications. It is powered by 800MHz TI AM3354 ARM Cortex-A8 processor which features PowerVR™ SGX530 for 2D and 3D graphics acceleration. In addition to a DDR3L RAM memory, the MYC-C335X-GW is equipped with a Nand Flash or an eMMC Flash. It has an integrated PMIC on board and two 0.8mm pitch 80-pin board-to-board expansion connectors for interconnecting with your base board, thus providing an interface for the base board to carry out most of the I/O signals to and from the CPU module.

MYC-C335X-GW Top-view

MYC-C335X-GW Bottom-view

The MYC-C335X-GW CPU Module is compatible to use other AM335X processors which are with 15x15mm ZCZ package and sharing the same pin-out with software fully compatible. MYIR delivers MYC-C3354-GW by default. The main differences of the usable Sitara AM335x can be known from below image.

AM335x Devices Comparison

MYIR has designed the MYD-C335X-GW development board for evaluating the MYC-C335X-GW. The base board has extended versatile peripheral interfaces and capable of running Linux OS. A plenty of software resources are provided to help accelerate customers’ designs with a stable and reliable hardware and software platform.

MYD-C335X-GW Development Board

MYD-C335X-GW in the Video

- Unboxing MYD-C335X-GW Development Kit Based on TI AM335x ARM Cortex A8 processor

Features

Mechanical Parameters

• Dimensions: 50mm x 40mm
• PCB Layers:8-layer design
• Supply voltage: 4.75-5.25V
• Working temperature: -40~85 Celsius (industrial grade)

Processor

• TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (pin-to-pin compatible, 15 x15mm, 0.8-mm ball pitch, ZCZ packge)
  - NEON™ SIMD Coprocessor
  - 32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection (parity)
  - 256KB of L2 Cache with Error Correcting Code (ECC)
  - SGX530 Graphics Engine
  - Programmable Real-Time Unit Subsystem

Memory

• 256/512MB DDR3L (supports up to 1GB)
• 256MB Nand Flash (supports optional 512MB/1GB)
• 4GB eMMC (alternative design with Nand Flash)
• 256Kbit EEPROM
  

Peripherals and Signals Routed to Pins

• Power Management IC (TPS65217C)
• Two 0.8mm pitch 80-pin expansion connectors can carry out interfaces below
  - 2 x RGMII
  - 2 x USB2.0 Host or 2 x USB2.0 Device
  - 6 x UART
  - 3 x I2C
  - 2 x CAN
  - 2 x SPI
  - 7 x ADC
  - 1 x SAI
  - 1 x RGB (supports RGB888 at up to 2048 x 2048 pixels resolution)
  - 2 x SDIO
  - 1 x JTAG
  - 97 x GPIOs

Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet and CPU Module pin-out description file.

OS Support

• Linux 4.14.67

Other MYIR's TI Products

http://www.myirtech.com/tiseries.asp

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MYD-AM335X-Y Development Board (MCC-AM335X-Y CPU Module as core board, TI AM335x)

MYD-AM335X-J Development Board (MCC-AM335X-J CPU Module as core board, TI AM335x)

MYD-C437X Development Board (MYC-C437X CPU Module as core board, TI AM4378)

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