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Measuring only 43mm by 45mm, the MYC-YM62X CPU Module is a compact System-on Module (SoM) based on TI AM623 and TI AM625 microprocessors which among the TI Sitara AM62x MPU family and feature up to 1.4GHz Quad ARM Cortex-A53 and 400MHz Cortex-M4F cores, dual-display support and 3D GPU (only for AM625) graphics acceleration, along with an extensive set of peripherals such as dual TSN-enabled Gigabit Ethernet ports, USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/FPGA. In addition to the AM62x processor, the MYC-YM62X CPU module has integrated 1GB/2GB DDR4, 8GB eMMC, 32Kbit EEPROM and power management IC (PMIC). A variety of peripheral and IO signals are accessible via the 1.0 mm pitch 164-pin Castellated-Hole and 58-pin LGA Expansion Interfaces. With the excellent control and communication capabilities, the tiny module is well-suited for a broad range of industrial and display applications such as HMI, PLC, medical, EV charging stations, automation control or a monitor system.
MYC-YM62X CPU Module (MYC-YM6231 / MYC-YM6252 / MYC-YM6254)
MYIR provides complete software package for Linux 6.1 running on the MYC-YM62X CPU Module to help users launch their development quickly and easily.
The MYD-YM62X Development Board is built around the MYC-YM62X CPU Module to serve as a complete development platform for evaluation or prototype purposes. Its base board provides rich communication interfaces such as dual RS485, dual CAN, dual Gigabit Ethernet, dual USB Host and one OTG, one USB based 5G/4G module interface, one WiFi/BT module and one GPMC external memory bus. The board has also explored advanced multi-media capabilities of AM62x to support dual LVDS display, audio and camera as well as HDMI display support via a RGB conversion chip. MYIR offers MY-CAM003M MIPI Camera Module and MY-LVDS070C LCD Module as options for the MYD-YM62X board which allows customers to acquire better development experience.
MYD-YM62X Development Board (Top-view)
MYD-YM62X Development Board (Bottom-view)
Features
Mechanical Parameters
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Dimensions: 43mm x 45mm
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PCB Layers: 10-layer design
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Power supply: 5V/1A
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Working temperature: -40~85 Celsius (industrial grade)
Processor
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TI AM62x processor (AM6254/AM6252/AM6231)
- TI AM6254: 4*Cortex-A53@1.4GHz + Cortex-M4F@400MHz (AM6254ATCGGAALW)
- TI AM6252: 2*Cortex-A53@1.4GHz + Cortex-M4F@400MHz (AM6252ATCGGAALW)
- TI AM6231: 1*Cortex-A53@1.0GHz + Cortex-M4F@400MHz (AM6231ASGGGAALW)
- Two PRU-SS running up to 333MHz
- 3D GPU graphics accelerator (only for AM625 processors)
Memory
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1GB/2GB DDR4 (supports up to 4GB)
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8GB eMMC (supports up to 128GB)
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32KB EEPROM
Peripherals and Signals Routed to Pins
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Power Management IC (TPS6521901)
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1.0mm pitch 164-pin Castellated-Hole and 58-pin LGA Expansion Interfaces
- 2 x RGMII
- 2 x USB2.0
- 9 x UART
- 3 x CAN FD
- 6 x I2C
- 5 x SPI
- 1 x GPMC
- 2 x LVDS
- 1 x RGB
- 1 x MIPI-CSI
- 3 x MCASP
- 1 x JTAG
- Up to 143 x GPIOs
Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals are reused. Please refer to the processor datasheet.
OS Support
Other MYIR's TI Products
http://www.myirtech.com/tiseries.asp
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MYD-C335X-GW Development Board (MYC-C335X-GW CPU Module as core board, TI AM335x)
MYD-AM335X Development Board (MYC-AM335X CPU Module as core board, TI AM335x)
MYD-AM335X-Y Development Board (MCC-AM335X-Y CPU Module as core board, TI AM335x)
MYD-AM335X-J Development Board (MCC-AM335X-J CPU Module as core board, TI AM335x)
MYD-C437X Development Board (MYC-C437X CPU Module as core board, TI AM4378)
MYD-YM62X Development Board (MYC-YM62X CPU Module as core board, TI AM6254/6252/6231)
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Overview
