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ALLWinner Series
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MYC-YT507H CPU Module
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- 45mm by 43mm (10-layer PCB design)
- 1.5GHz ALLWINNER T507H Quad-core ARM Cortex-A53 Processor
- 1GB/2GB LPDDR4, 8GB eMMC Flash, 32Kbit EEPROM
- Allwinner AXP853T Power Management IC
- 1.0mm pitch 222-pin Stamp Hole Expansion Interface
- Linux / Android
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MYC-YT113X CPU Module
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- 39mm by 37mm (6-layer PCB design)
- Up to 1.2GHz Allwinner T113-S3 Dual-core ARM Cortex-A7 MPU with 128MB DDR3 and Single-core HiFi4 DSP
- 4GB eMMC/256MB Nand Flash, 32KB EEPROM
- 1.0mm pitch 140-pin Stamp Hole Expansion Interface
- Linux
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NXP Series
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MYC-J1028X CPU Module |
- 45mm by 82mm (12-layer PCB design)
- 1.5GHz NXP Layerscape LS1028A Application Processor based on Dual ARM Cortex-A72 Cores
- 2GB DDR4, 8GB eMMC Flash, 32Kbit EEPROM
- Temperature Sensor
- 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
- Delivered with heat sink
- Supports -40 to +85 Celsius Extended Temperature Operation
- Supports Ubuntu and Real-time Edge Images based on Linux Kernel
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 Contact Us
Phone: +86-755-22984836
Fax: +86-755-25532724
E-mail: sales@myirtech.com
myirtech@gmail.com
Address: Room 04, 6th Floor,
Building No.2, Fada Road,
Yunli Intelligent Park, Bantian, Longgang District, Shenzhen, Guangdong, China 518129
Product Categories
Download Center
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MYC-JX8MPQ CPU Module
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- 45mm by 82mm (8-layer PCB design)
- NXP i.MX 8M Plus Quad Application Processor based on 1.6 GHz Arm Cortex-A53 and 800MHz Cortex-M7 Cores
- A Neural Processing Unit (NPU) Operating at up to 2.3 TOP
- 3GB LPDDR4, 8GB eMMC Flash, 32MB QSPI Flash
- Power Management IC (PMIC)
- 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
- Supports Working Temperature Ranging from -40°C to 85°C
- Supports Running Linux L5.10.9
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MYC-JX8MX CPU Module
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- 50mm by 82mm (10-layer PCB design)
- 1.3GHz NXP i.MX 8M Quad Application Processor
- 1GB / 2GB LPDDR4, 8GB eMMC, 256Mbit QSPI Flash
- On-board Gigabit Ethernet PHY
- Power Management IC (ROHM BD71837MWV)
- 0.5mm pitch 314-pin MXM 3.0 Expansion Connector
- Delivered with heat sink
- Supports -30 to +80 Celsius Extended Temperature Operation
- Linux, Android
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MYC-C8MMX-V2 CPU Module
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- 60mm by 49mm (8-layer PCB design)
- Up to 1.8GHz NXP i.MX 8M Mini Quad Application Processor
- 2GB DDR4, 8GB eMMC, 32MB QSPI Flash
- On-board Gigabit Ethernet PHY (YT8511)
- Power Management IC (ROHM BD71847MWV)
- Two 0.8mm pitch 100-pin Board-to-Board Expansion Connectors
- Supports -40 to +85 Celsius Extended Temperature Operation
- Supports Running Yocto Linux, Ubuntu Linux, Android
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MYC-JX8MMA7 CPU Module
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- 82mm by 45mm (10-layer PCB design)
- Up to 1.8GHz NXP i.MX 8M Mini Quad Application Processor
- Xilinx XC7A25T Artix-7 FPGA
- ARM: 2GB LPDDR4, 8GB eMMC, 32MB QSPI Flash
- FPGA: 256MB DDR3, 32MB QSPI Flash
- Two PMIC ROHM BD71847AMWV (one for ARM and one for FPGA)
- 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
- Supports -40 to +85 Celsius Extended Temperature Operation
- Supports Running Linux
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MYC-Y6ULX-V2 CPU Module
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- 37mm by 39mm (8-layer PCB design)
- 512MHz NXP i.MX 6UltraLite / 6ULL ARM Cortex-A7 processor
- 256MB DDR3, 256MB Nand Flash (4GB eMMC Flash is optional)
- On-board Ethernet PHY
- 1.0mm pitch 140-pin Stamp Hole Expansion Interface for Board-to-Board Connections
- Delivered with shield cover
- Supports -40 to +85 Celsius Extended Temperature Operation
- Linux
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RENESAS Series
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MYC-YG2LX CPU Module |
- 45mm by 43mm (10-layer PCB design)
- RENESAS RZ/G2L processor (R9A07G044L23GBG)
- 1.2GHz Dual ARM Cortex-A55 and 200MHz Cortex-M33 Cores
- 1GB/2GB DDR4, 8GB eMMC Flash, 32KB EEPROM
- RAA215300 Power Management IC
- 1.0mm pitch 222-pin Stamp Hole Expansion Interface
- Linux 5.10
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ST Series
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MYC-YA157C CPU Module |
- 45mm by 43mm (8-layer PCB design)
- STMicroelectronics STM32MP157AAC3 Microprocessor
- 650MHz Dual Arm Cortex-A7 and 209MHz Cortex-M4 Cores
- 512MB DDR3, 4GB eMMC Flash
- On-board Gigabit Ethernet PHY
- Power Management IC (PMIC)
- 1.0mm pitch 164-pin Stamp Hole Expansion Interface
- Linux
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MYC-YA15XC-T CPU Module |
- 39mm by 37mm (10-layer PCB design)
- STMicroelectronics STM32MP151AAC3 Microprocessor
- 650MHz Single Arm Cortex-A7 and 209MHz Cortex-M4 Cores
- 256MB DDR3L, 256MB Nand Flash / 512MB DDR3L, 4GB eMMC Flash
- 32KB EEPROM
- Power Management IC (STPMIC1APQR)
- 1.0mm pitch 148-pin Stamp Hole Expansion Interface
- Linux
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TI Series
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MYC-C335X-GW CPU Module |
- 50mm by 40mm (8-layer PCB design)
- Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors
- 256/512MB DDR3L, 256MB Nand Flash / 4GB eMMC
- Power Management IC (TPS65217C)
- Two 0.8mm pitch 80-pin Board-to-Board Expansion Connectors
- Supports -40 to +85 Celsius Extended Temperature Operation
- Linux
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| Read more... |
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MYC-AM335X CPU Module |
- 70mm by 50mm (8-layer PCB design)
- Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors
- 512MB DDR3 SDRAM, 512MB Nand Flash (Optional eMMC)
- On-board Gigabit Ethernet PHY
- Two 2.0mm pitch 60-pin Male Expansion Connectors
- Supports -40 to +85 Celsius Extended Temperature Operation
- Linux
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MCC-AM335X-Y CPU Module |
- 65mm by 35mm (10-layer PCB design)
- Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors
- 256MB DDR3 SDRAM, 256MB Nand Flash (Optional eMMC)
- On-board Gigabit Ethernet PHY
- Power Management IC (PMIC)
- 1.27mm pitch 146-pin Stamp Hole Expansion Interface
- Supports -40 to +85 Celsius Extended Temperature Operation
- Linux
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| Read more... |
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MCC-AM335X-J CPU Module |
- 67.6mm by 45mm (8-layer PCB design)
- Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors
- 256MB DDR3 SDRAM, 256MB Nand Flash (Optional eMMC)
- On-board Gigabit Ethernet PHY
- Power Management IC (PMIC)
- DDR2 SO-DIMM 200-pin Expansion Interface
- Supports -40 to +85 Celsius Extended Temperature Operation
- Linux
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| Read more... |
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MYC-C437X CPU Module |
- 60mm by 45mm (8-layer PCB design)
- Up to 1GHz TI AM437x Series ARM Cortex-A9 Processors
- 512MB DDR3 SDRAM, 4GB eMMC Flash, 32KB EEPROM
- On-board Gigabit Ethernet PHY
- Power Management IC (PMIC)
- Two 0.8mm pitch 100-pin Board-to-Board Expansion Connectors
- Supports -40 to +85 Celsius Extended Temperature Operation
- Provided with Linux and SYS/BIOS (TI-RTOS) Software Packages
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Xilinx Series
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MYC-CZU3EG/4EV/5EV-V2 CPU Module
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- 60mm by 52mm (12-layer PCB design)
- Xilinx Zynq UltraScale+ ZU3EG/4EV/5EV MPSoC
- 1.2 GHz Quad Arm Cortex-A53 and 600MHz Dual Cortex-R5 Cores
- ARM Mali™-400MP2 Graphics Processor
- 16nm FinFET+ FPGA fabric
- 4GB DDR4, 4GB eMMC, 128MB QSPI Flash
- On-board Gigabit Ethernet PHY, USB PHY
- Intel Power Module, Clock Generator
- Two Samtec 0.5mm pitch 160-pin Razor Beam High-Speed Headers
- Linux
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MYC-Y7Z010/20-V2 CPU Module
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- 75mm by 50mm (10-layer PCB design)
- 667MHz Xilinx XC7Z010/20 (Zynq-7010/7020) All Programmable SoC
- ARM Cortex-A9 Processing System with Xilinx 7-series FPGA Logic
- 512MB DDR3 SDRAM, 4GB eMMC, 16MB QSPI Flash
- On-board Gigabit Ethernet PHY (YT8521SH)
- 1.27mm pitch 180-pin Stamp Hole Expansion Interface
- Linux
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| Read more... |
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MYC-C7Z010/20-V2 CPU Module
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- 75mm by 55mm (10-layer PCB design)
- 667MHz Xilinx XC7Z010/020 (Zynq-7010/7020) All Programmable SoC
- Dual-core ARM Cortex-A9 Processing System with Xilinx 7-series FPGA Logic
- 1GB DDR3 SDRAM, 4GB eMMC, 32MB QSPI Flash
- On-board Gigabit Ethernet PHY
- Power Management IC (PMIC)
- Two 0.8mm pitch 140-pin Board-to-Board Expansion Connectors
- Linux
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| Read more... |
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MYC-C7Z015 CPU Module
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- 75mm by 55mm (12-layer PCB design)
- 667MHz Xilinx XC7Z015 (Zynq-7015) All Programmable SoC
- Dual-core ARM Cortex-A9 Processing System with Xilinx 7-series FPGA Logic
- 1GB DDR3 SDRAM, 4GB eMMC, 32MB QSPI Flash
- On-board Gigabit Ethernet PHY
- Two 0.8mm pitch 140-pin Board-to-Board Expansion Connectors
- Linux
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| Read more... |
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MYIR Product Catalog
