TI Series CPU Modules
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ALLWinner Series

MYC-YT507H CPU Module
  • 45mm by 43mm (10-layer PCB design)
  • 1.5GHz ALLWINNER T507H Quad-core ARM Cortex-A53 Processor
  • 1GB/2GB LPDDR4, 8GB eMMC Flash, 32Kbit EEPROM 
  • Allwinner AXP853T Power Management IC
  • 1.0mm pitch 222-pin Stamp Hole Expansion Interface
  • Linux / Android
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MYC-YT113X CPU Module
  • 39mm by 37mm (6-layer PCB design)
  • Up to 1.2GHz Allwinner T113-S3 Dual-core ARM Cortex-A7 MPU with 128MB DDR3 and Single-core HiFi4 DSP
  • 4GB eMMC/256MB Nand Flash, 32KB EEPROM
  • 1.0mm pitch 140-pin Stamp Hole Expansion Interface
  • Linux
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MYC-YT113i CPU Module
  • 39mm by 37mm (8-layer PCB design)
  • Up to 1.2GHz Allwinner T113-i Dual-core ARM Cortex-A7 MPU with Single-core HiFi4 DSP
  • 512MB/1GB DDR3, 4GB/8GB eMMC, 32KB EEPROM
  • 1.0mm pitch 140-pin Stamp Hole Expansion Interface + 50-pin LGA
  • Linux
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NXP Series

MYC-J1028X CPU Module
  • 45mm by 82mm (12-layer PCB design)
  • 1.5GHz NXP Layerscape LS1028A Application Processor based on Dual ARM Cortex-A72 Cores
  • 2GB DDR4, 8GB eMMC Flash, 32Kbit EEPROM
  • Temperature Sensor
  • 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector 
  • Delivered with heat sink
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Supports Ubuntu and Real-time Edge Images based on Linux Kernel
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MYC-JX8MPQ CPU Module
  • 45mm by 82mm (8-layer PCB design)
  • NXP i.MX 8M Plus Quad Application Processor based on 1.6 GHz Arm Cortex-A53 and 800MHz Cortex-M7 Cores
  • A Neural Processing Unit (NPU) Operating at up to 2.3 TOP
  • 3GB LPDDR4, 8GB eMMC Flash, 32MB QSPI Flash
  • Power Management IC (PMIC)
  • 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
  • Supports Working Temperature Ranging from -40°C to 85°C
  • Supports Running Linux L5.10.9
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MYC-JX8MX CPU Module
  • 50mm by 82mm (10-layer PCB design)
  • 1.3GHz NXP i.MX 8M Quad Application Processor
  • 1GB / 2GB LPDDR4, 8GB eMMC, 256Mbit QSPI Flash
  • On-board Gigabit Ethernet PHY
  • Power Management IC (ROHM BD71837MWV)
  • 0.5mm pitch 314-pin MXM 3.0 Expansion Connector 
  • Delivered with heat sink
  • Supports -30 to +80 Celsius Extended Temperature Operation
  • Linux, Android
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MYC-C8MMX-V2 CPU Module
  • 60mm by 49mm (8-layer PCB design)
  • Up to 1.8GHz NXP i.MX 8M Mini Quad Application Processor
  • 2GB DDR4, 8GB eMMC, 32MB QSPI Flash
  • On-board Gigabit Ethernet PHY (YT8511)
  • Power Management IC (ROHM BD71847MWV)
  • Two 0.8mm pitch 100-pin Board-to-Board Expansion Connectors
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Supports Running Yocto Linux, Ubuntu Linux, Android
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MYC-JX8MMA7 CPU Module
  • 82mm by 45mm (10-layer PCB design)
  • Up to 1.8GHz NXP i.MX 8M Mini Quad Application Processor
  • Xilinx XC7A25T Artix-7 FPGA
  • ARM: 2GB LPDDR4, 8GB eMMC, 32MB QSPI Flash
  • FPGA: 256MB DDR3, 32MB QSPI Flash
  • Two PMIC ROHM BD71847AMWV (one for ARM and one for FPGA)
  • 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Supports Running Linux
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MYC-Y6ULX-V2 CPU Module
  • 37mm by 39mm (8-layer PCB design)
  • 512MHz NXP i.MX 6UltraLite / 6ULL ARM Cortex-A7 processor 
  • 256MB DDR3, 256MB Nand Flash (4GB eMMC Flash is optional)
  • On-board Ethernet PHY
  • 1.0mm pitch 140-pin Stamp Hole Expansion Interface for Board-to-Board Connections 
  • Delivered with shield cover
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Linux
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RENESAS Series

MYC-YG2LX CPU Module
  • 45mm by 43mm (10-layer PCB design)
  • RENESAS RZ/G2L processor (R9A07G044L23GBG)
  • 1.2GHz Dual ARM Cortex-A55 and 200MHz Cortex-M33 Cores 
  • 1GB/2GB DDR4, 8GB eMMC Flash, 32KB EEPROM
  • RAA215300 Power Management IC
  • 1.0mm pitch 222-pin Stamp Hole Expansion Interface
  • Linux 5.10
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SemiDrive Series

MYC-JD9360 CPU Module
  • 45mm by 82mm (8-layer PCB design)
  • SemiDrive D9-Pro Processor (D9360)
  • 1.6GHz Six ARM Cortex-A55 and Cortex-R5 Cores
  • Supports 100GFLOPS PowerVR 9XM GPU,
    VPU Codec H.265/H.264 /VP8/VP9 and 0.8Tops NPU
  • 2GB LPDDR4, 16GB eMMC, 16MB QSPI Nor Flash, 256Kbit EEPROM
  • 0.5mm pitch 314-pin MXM 3.0 Gold-finger-edge-card Connector
  • Linux, Ubuntu, Android
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ST Series

MYC-YA157C CPU Module
  • 45mm by 43mm (8-layer PCB design)
  • STMicroelectronics STM32MP157AAC3 Microprocessor
  • 650MHz Dual Arm Cortex-A7 and 209MHz Cortex-M4 Cores 
  • 512MB DDR3, 4GB eMMC Flash
  • On-board Gigabit Ethernet PHY
  • Power Management IC (PMIC)
  • 1.0mm pitch 164-pin Stamp Hole Expansion Interface
  • Linux
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MYC-YA15XC-T CPU Module
  • 39mm by 37mm (10-layer PCB design)
  • STMicroelectronics STM32MP151AAC3 Microprocessor
  • 650MHz Single Arm Cortex-A7 and 209MHz Cortex-M4 Cores 
  • 256MB DDR3L, 256MB Nand Flash / 512MB DDR3L, 4GB eMMC Flash
  • 32KB EEPROM
  • Power Management IC (STPMIC1APQR)
  • 1.0mm pitch 148-pin Stamp Hole Expansion Interface
  • Linux
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MYC-YF13X CPU Module
  • 39mm by 37mm (10-layer PCB design)
  • STMicroelectronics STM32MP135DAF7 Microprocessor
  • 1GHz Single Arm Cortex-A7 Core 
  • 256/512MB DDR3L, 256MB Nand Flash / 4GB eMMC Flash
  • 32Kbit EEPROM
  • 1.0mm pitch 148-pin Stamp Hole Expansion Interface
  • Linux 5.15
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TI Series

MYC-YM62X CPU Module
  • 43mm by 45mm (10-layer PCB design)
  • TI AM62x processor (AM6254/AM6252/AM6231)
  • up to 1.4GHz Quad ARM Cortex-A53 and 400MHz Cortex-M4F Cores 
  • 1GB/2GB DDR4, 8GB eMMC Flash, 32KB EEPROM
  • Power Management IC (TPS6521901)
  • 1.0mm pitch 222-pin Stamp Hole Expansion Interface
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Linux
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MYC-C335X-GW CPU Module
  • 50mm by 40mm (8-layer PCB design)
  • Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors 
  • 256/512MB DDR3L, 256MB Nand Flash / 4GB eMMC
  • Power Management IC (TPS65217C) 
  • Two 0.8mm pitch 80-pin Board-to-Board Expansion Connectors
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Linux
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MYC-AM335X CPU Module
  • 70mm by 50mm (8-layer PCB design)
  • Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors 
  • 512MB DDR3 SDRAM, 512MB Nand Flash (Optional eMMC)
  • On-board Gigabit Ethernet PHY 
  • Two 2.0mm pitch 60-pin Male Expansion Connectors
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Linux
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MCC-AM335X-Y CPU Module
  • 65mm by 35mm (10-layer PCB design)
  • Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors
  • 256MB DDR3 SDRAM, 256MB Nand Flash (Optional eMMC)
  • On-board Gigabit Ethernet PHY 
  • Power Management IC (PMIC)
  • 1.27mm pitch 146-pin Stamp Hole Expansion Interface
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Linux
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MCC-AM335X-J CPU Module
  • 67.6mm by 45mm (8-layer PCB design)
  • Up to 1GHz TI AM335x Series ARM Cortex-A8 Processors
  • 256MB DDR3 SDRAM, 256MB Nand Flash (Optional eMMC)
  • On-board Gigabit Ethernet PHY 
  • Power Management IC (PMIC)
  • DDR2 SO-DIMM 200-pin Expansion Interface
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Linux
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MYC-C437X CPU Module
  • 60mm by 45mm (8-layer PCB design)
  • Up to 1GHz TI AM437x Series ARM Cortex-A9 Processors 
  • 512MB DDR3 SDRAM, 4GB eMMC Flash, 32KB EEPROM
  • On-board Gigabit Ethernet PHY
  • Power Management IC (PMIC)
  • Two 0.8mm pitch 100-pin Board-to-Board Expansion Connectors 
  • Supports -40 to +85 Celsius Extended Temperature Operation
  • Provided with Linux and SYS/BIOS (TI-RTOS) Software Packages
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Xilinx Series

MYC-CZU3EG/4EV/5EV-V2 CPU Module
  • 60mm by 52mm (12-layer PCB design)
  • Xilinx Zynq UltraScale+ ZU3EG/4EV/5EV MPSoC
  • 1.2 GHz Quad Arm Cortex-A53 and 600MHz Dual Cortex-R5 Cores 
  • ARM Mali™-400MP2 Graphics Processor
  • 16nm FinFET+ FPGA fabric
  • 4GB DDR4, 4GB eMMC, 128MB QSPI Flash
  • On-board Gigabit Ethernet PHY, USB PHY
  • Intel Power Module, Clock Generator
  • Two Samtec 0.5mm pitch 160-pin Razor Beam High-Speed Headers
  • Linux
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MYC-Y7Z010/20-V2 CPU Module
  • 75mm by 50mm (10-layer PCB design)
  • 667MHz Xilinx XC7Z010/20 (Zynq-7010/7020) All Programmable SoC 
  • ARM Cortex-A9 Processing System with Xilinx 7-series FPGA Logic
  • 512MB DDR3 SDRAM, 4GB eMMC, 16MB QSPI Flash
  • On-board Gigabit Ethernet PHY (YT8521SH)
  • 1.27mm pitch 180-pin Stamp Hole Expansion Interface
  • Linux
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MYC-C7Z010/20-V2 CPU Module
  • 75mm by 55mm (10-layer PCB design)
  • 667MHz Xilinx XC7Z010/020 (Zynq-7010/7020) All Programmable SoC 
  • Dual-core ARM Cortex-A9 Processing System with Xilinx 7-series FPGA Logic
  • 1GB DDR3 SDRAM, 4GB eMMC, 32MB QSPI Flash
  • On-board Gigabit Ethernet PHY
  • Power Management IC (PMIC)
  • Two 0.8mm pitch 140-pin Board-to-Board Expansion Connectors
  • Linux
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MYC-C7Z015 CPU Module
  • 75mm by 55mm (12-layer PCB design)
  • 667MHz Xilinx XC7Z015 (Zynq-7015) All Programmable SoC 
  • Dual-core ARM Cortex-A9 Processing System with Xilinx 7-series FPGA Logic
  • 1GB DDR3 SDRAM, 4GB eMMC, 32MB QSPI Flash
  • On-board Gigabit Ethernet PHY
  • Two 0.8mm pitch 140-pin Board-to-Board Expansion Connectors
  • Linux
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