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Development Environment

Xilinx SDSoC (1)

HMI Solutions

MYD-Y6ULX-CHMI (i.MX 6UL/6ULL) (1)

MY-EVC5100S-HMI (TI AM335x) (1)

Single Board Computers

MYS-6ULX (NXP i.MX 6UL/6ULL) (2)

Rico Board (TI AM437x) (1)

FZ3 Card (Xilinx ZU3EG) (1)

Z-turn Board (Xilinx Zynq-7010/20) (1)

Z-turn Lite (Xilinx Z-7007S/7010) (1)

MYS-SAM9X5 (Atmel SAM9X5) (1)

MYS-SAM9G45 (Atmel SAM9G45) (1)

MYS-S5PV210 (Samsung S5PV210) (1)

CPU Modules

MYC-CZU3EG/4EV (ZU3EG/4EV) (1)

MYC-Y7Z010/20 (Zynq-7010/20) (1)

MYC-C7Z010/20 (Zynq-7010/20) (1)

MYC-C7Z015 (Xilinx Zynq-7015) (1)

MYC-YA157C (ST STM32MP157A) (1)

MYC-C8MMX (NXP i.MX 8M Mini) (1)

MYC-JX8MX (NXP i.MX8M) (1)

MYC-Y6ULX (NXP i.MX 6UL/6ULL) (1)

MYC-IMX28X (NXP i.MX28) (1)

MYC-C335X-GW (TI AM335x) (1)

MCC-AM335X-Y (TI AM335x) (1)

MYC-AM335X (TI AM335x) (1)

MCC-AM335X-J (TI AM335x) (1)

MYC-C437X (TI AM437x) (1)

MYC-SAMA5D3X (Atmel A5D3) (1)

MYC-JA5D4X (Atmel A5D4) (1)

MYC-JA5D2X (Atmel A5D2) (1)

MCC-SAMA5D3X-C (Atmel A5D3) (1)

MYC-SAM9X5 (Atmel SAM9X5) (1)

MYC-SAM9X5-V2 (Atmel SAM9X5) (1)

MYC-S5PV210 (Samsung S5PV210) (1)

MYC-Exynos4412 (Samsung) (1)

Development Boards

VECP Starter Kit (Xilinx ZU3EG) (1)

MYD-CZU3EG/4EV (ZU3EG/4EV) (1)

MYD-C7Z010/20 (Zynq-7010/20) (1)

MYD-Y7Z010/20 (Zynq-7010/20) (1)

MYD-C7Z015 (Xilinx Zynq-7015) (1)

MYD-IMX28X (NXP i.MX28) (1)

MYD-YA157C (ST STM32MP157A) (1)

MYD-Y6ULX (NXP i.MX 6UL/6ULL) (1)

MYD-JX8MX (NXP i.MX8M) (1)

MYD-C8MMX (NXP i.MX 8M Mini) (1)

MYD-Y6ULX-HMI (i.MX 6UL/6ULL) (1)

MYD-C335X-GW (TI AM335x) (1)

MYD-C437X (TI AM437x) (1)

MYD-AM335X-Y (TI AM335x) (1)

MYD-AM335X-J (TI AM335x) (1)

MYD-AM335X (TI AM335x) (1)

MYD-C437X-PRU (TI AM437x) (1)

MYD-JA5D4X (Atmel A5D4) (1)

MYD-SAMA5D3X-C (Atmel A5D3) (1)

MYD-SAMA5D3X (Atmel A5D3) (1)

MYD-JA5D2X (Atmel A5D2) (1)

MYD-SAM9X5 (Atmel SAM9X5) (1)

MYD-SAM9X5-V2 (Atmel SAM9X5) (1)

MYD-LPC185X (NXP LPC185x) (2)

MYD-LPC435X (NXP LPC435x) (2)

MYD-LPC1788 (NXP LPC1788) (1)

Add-on Options

Z-turn IO Cape (for Z-turn Board) (1)

Z-turn Lite IO Cape (for Z-turn Lite) (1)

MYD-Y7Z010/20 IO Cape (1)

MYB-Y6ULX-HMI-4GEXP (1)

MYB-6ULX (for MYS-6ULX) (1)

MY-LCD43TP LCD Module (1)

MY-LCD70TP LCD Module (1)

MY-LCD70TP-C LCD Module (1)

MY-LVDS070C LCD Module (1)

MY-WF003U USB WiFi Module (1)

MY-WF004S SDIO WiFi Module (1)

MY-CAM002U Camera Module (1)

MY-CAM011B BUS Camera Module (1)

MY-UART012U Convertor (1)

MY-CAM003M Camera Module (1)

MY-SODIMM200 Socket (1)

MY-ZB010C ZigBee Module (1)

MY-ZB010C-E ZigBee EVM (1)

    Product Updates
          Products >  Development Boards >  VECP Starter Kit (Xilinx ZU3EG) > VECP Starter Kit
 
VECP Starter Kit

VECP Starter Kit

- Xilinx Zynq UltraScale+ ZU3EG MPSoC based on 1.2 GHz Quad Arm Cortex-A53 and 600MHz Dual Cortex-M4 Cores
- 4GB DDR4, 4GB eMMC, 128MB QSPI Flash
- 1 x USB 3.0 Host, 1 x USB 3.0 Device, 1 x USB-UART, 2 x Gigabit Ethernets, MIPI-CSI, HDMI, TF…
- SONY imx334 4K Sensor
- Ready to Run Linux OS
- 4k/30fps Image Signal Processing IP Core
- GigE Vison 2.0 IP Core
- Machine Vision USB3 Vision IP Core
 

MYIR is a Xilinx Alliance Member, welcome to use MYIR's Xilinx products!
We also offer custom design services, welcome your inquiry!

http://www.xilinx.com/alliance/memberlocator/1-2wv1bc.html


The VECP Starter Kit is an affordable and complete Vision Edge Computing Platform to provide an excellent image processing solution for computer vision development based on Xilinx Zynq UltraScale+ ZU3EG MPSoC which features a 1.2 GHz quad-core ARM Cortex-A53 64-bit application processor, a 600MHz dual-core real-time ARM Cortex-R5 processor, a Mali400 embedded GPU and rich FPGA fabric. The kit comes with a MYD-CZU3EG-ISP development board and some necessary cable accessories to help users start their development rapidly.




The MYD-CZU3EG-ISP development board is capable of handling 4K video at 30fps through the built-in ISP core and can implement ultra-low delay video transmission at maximum 0.7ms. The input videos support Bayer, YCbCr and RGB formats to meet the demand of high frame rate and high-resolution image acquisition. The image can be output through diversified image output interfaces including HDMI, Gigabit Ethernet and USB 3.0. The integrated GigE vision IP core supports Machine Vision GenICam V2.4.0 standard and user-defined XML files. The USB3 vison IP core also meets the industrial machine vision standard.

VECP Data Processing Frame


The MYD-CZU3EG-ISP development board consists of a MYC-CZU3EG CPU Module with installed active heatsink, a base board and a SONY imx334 4K Sensor which is installed on the rear of the base board and connected to the MIPI-CSI interface through an FPC cable. From the CPU PL part, the board has extended one Gigabit Ethernet, one USB 3.0 device and one HDMI interface for image output. From the PS part, the board has extended one USB-to-UART interface, one USB 3.0 Host, one TF card slot and one Gigabit Ethernet for data communication purpose. The board is ready to run Linux operating system provided with plenty of software resources.



MYIR also offer custom design services for board design based on the MYD-CZU3EG-ISP development board or customized image sensors or customized IP cores according to customers’ requirements.



The built-in ISP core of the MYD-CZU3EG-ISP development board has excellent image processing capabilities. It has outstanding intelligent noise reduction effect and can separate from motion area and background accurately. The digital WDR function and super 3D denoise technology of the ISP core can restore information from ultra-low illuminance precisely. The automatic exposure strategy can be adopted according to different usage scenarios and the color reduction is strong. The right images below are processed through the IP cores of the MYD-CZU3EG-ISP development board which may make you feel the difference.



Image Effect Comparison


Features

Description

CPU

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E (ZU3EG, 784 Pin Package) MPSoC
- 1.2GHz 64 bit Quad-core ARM® Cortex™-A53
- 600MHz Dual-core ARM® Cortex™-R5 proce
- ARM Mali™-400MP2 Graphics Processor
- 16nm FinFET+ FPGA fabric

RAM

4GB DDR4 SDRAM (64-bit, 2400MHz)

Flash

4GB eMMC, 128MB QSPI

PS Unit

One USB 3.0 Host

One USB-UART interface

One TF card slot

One 10/100/1000Mbps Ethernet interface

One 2.54mm pitch 14-pin JTAG interface (PS, PL reused)

PL Unit

One HDMI interface

One 10/100/1000Mbps Ethernet interface

One USB 3.0 device

One MIPI-CSI interface (0.5mm pitch 40-pin FPC connector, on the rear of the base board)

IO Expansion interface (0.5mm pitch 50-pin FPC connector, on the rear of the base board)

Image Sensor

SONY IMX334LLR

Resolution: 3840(H) x 2160 (V)

Mega Pixels: 8.42 MP

Frame Rate: 60 to 120 fps

ADC Resolution: 12-bit

Pixel Size: 2.0 μm × 2.0 μm

Interface: MIPI CSI-2

Dimensions

106.71mm x 69.98mm (base board)

Power supply

DC12V/2A

Working temp.

0~70 Celsius (commercial grade)

OS support

Linux 4.14.0

Target applications

IoT, Medical, Machine Vision, Industry, etc.

Packing List

One VECP Development Board

One HDMI cable

One 12V/2A Power adapter

One Mini USB 2.0 cable

One 16GB TF card

One Product disk

Features of VECP Starter Kit

VECP Starter Kit in the Video

- $599 Xilinx ZYNQ UltraScale MPSoC VECP Kit with MIPI-CSI for image processing

- VECP Start Kit based on Zynq UltraScale+ MPSoC image output test


Other MYIR's Xilinx Products

http://www.myirtech.com/xilinxseries.asp

Z-turn Board Single Board Computer (based on Zynq-7010 / 7020)

Z-turn Lite Single Board Computer (based on Zynq-7007S / Zynq-7010)

MYD-C7Z015 Development Board (MYC-C7Z015 CPU Module as core board)

MYD-Y7Z010/20 Development Board (MYC-Y7Z010/20 CPU Module as core board)

MYD-C7Z010/20 Development Board (MYC-C7Z010/20 CPU Module as core board)

MYD-CZU3EG Development Board (MYC-CZU3EG CPU Module as core board)

MYD-CZU4EV Development Board (MYC-CZU4EV CPU Module as core board)

FZ3 Card - deep learning accelerator card (based on Xilinx Zynq UltraScale+ ZU3EG MPSoC)


Hardware Features

Zynq® UltraScale+™ MPSoC devices provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. Built on a common real-time processor and programmable logic equipped platform, three distinct variants include dual application processor (CG) devices, quad application processor and GPU (EG) devices, and video codec (EV) devices.

Zynq UltraScale+ MPSoCs

The Zynq UltraScale+ family provides footprint compatibility to enable users to migrate designs from one device to another. Any two packages with the same footprint identifier code (last letter and number sequence) are footprint compatible. MYIR is using the XCZU3EG-1SFVC784E MPSoC for MYD-CZU3EG Development Board by default, the C784 package covers the widest footprint compatibilities that enable users to select devices among CG, EG and EV.


Zynq UltraScale+ MPSoC Device Migration Table

MYIR may also supply the MYC-CZU3EG CPU Modules with XCZU2CG, XCZU3CG, XCZU4EV or XCZU5EV MPSoC as options. The main features for the MPSoC devices are summarized as below.

Device

XCZU2CG

XCZU3CG

XCZU3EG

XCZU4EV

XCZU5EV

Logic cells (k)

103

154

154

192

256

CLB Flip-Flops (K)

94

141

141

176

234

CLB LUTs (K)

47

71

71

88

117

Block RAM (Mb)

5.3

7.6

7.6

4.5

5.1

UltraRAM (Mb)

-

-

-

13.5

18.0

DSP Slices

240

360

360

728

1,248

GTX transceivers

PS-GTR4x (6Gb/s)

PS-GTR4x (6Gb/s)

PS-GTR4x (6Gb/s)

PS-GTR4x (6Gb/s), GTH4x (16.3Gb/s)

PS-GTR4x (6Gb/s), GTH4x (16.3Gb/s)

Processor Units

Application Processor Unit

Dual-core ARM® Cortex™-A53 MPCore™ up to 1.3GHz

Quad-core ARM® Cortex™-A53 MPCore™ up to 1.5GHz

Memory w/ECC

L1 Cache 32KB I / D per core, L2 Cache 1MB, on-chip Memory 256KB

Real-Time Processor Unit

Dual-core ARM Cortex-R5 MPCore™ up to 600MHz

Memory w/ECC

L1 Cache 32KB I / D per core, Tightly Coupled Memory 128KB per core

Graphics Processing Unit

-

-

Mali™-400 MP2 up to 667MHz

Video Codec

-

-

-

H.264 / H.265

Memory L2 Cache

64KB

External Memory, Connectivity, Integrated Block Functionality

Dynamic Memory Interface

x32/x64: DDR4, LPDDR4, DDR3, DDR3L, LPDDR3 with ECC

Static Memory Interfaces

NAND, 2x Quad-SPI

High-Speed Connectivity

PCIe® Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x Tri-mode Gigabit Ethernet

General Connectivity

2 x USB 2.0, 2 x SD/SDIO, 2 x UART, 2 x CAN 2.0B, 2 x I2C, 2 x SPI, 4 x 32b GPIO

Power Management

Full / Low / PL / Battery Power Domains

Security

RSA, AES, and SHA

AMS - System Monitor

10-bit, 1MSPS – Temperature and Voltage Monitor


Zynq UltraScale+ MPSoC Device Selection Guide




Function Block Diagram of MYD-CZU3EG-ISP Development Board






Software Features

The MYD-CZU3EG-ISP Development Board is preloaded with Linux OS. MYIR provides software package in a product disk along with the goods delivery. The software package features as below:

Item

Features

Description

Remark

Cross compiler

gcc 7.2.1

gcc version 7.2.1 (Linaro GCC7.2)

Boot program

BOOT.BIN

First boot program including FSBL, u-boot2018.01

Source code provided

Linux Kernel

Linux 4.14.0

Customized kernel for VECP Starter Kit

Source code provided

Drivers

USB Host

USB2.0/USB3.0 Host driver

Source code provided

Ethernet

Gigabit Ethernet driver

Source code provided

MMC/SD/TF

MMC/SD/TF card driver

Source code provided

Camera

Camera driver

Source code provided

HDMI

HDMI (SiI1136 X chip) driver

Source code provided

Button

Button driver

Source code provided

UART

UART driver

Source code provided

I2C

I2C driver

Source code provided

LED

LED driver

Source code provided

GPIO

GPIO driver

Source code provided

QSPI

QSPI Flash MT25QU512ABB driver

Source code provided

Watch dog

Watch dog driver

Source code provided

Applications

Net

Socket program

Source code provided

File System

Ramdisk

Ramdisk system image

File System

Rootfs.tar

Buildroot, including QT

Source code provided

Software Features of VECP Starter Kit

Relative Download and Links


You can download relative chip datasheet, products datasheet, user manual, software package from below. Detailed technical data available on request.


1 VECP Starter Kit Overview 984 KB
2 Zynq UltraScale+ MPSoC Product Selection Guide 1.88 MB
3 MYC-CZU3EG Pinouts Description 525 KB


MYD-CZU3EG-ISP development board top-view (without active heatsink installed)


MYD-CZU3EG-ISP development board bottom-view (without image sensor installed)


Price and Ordering

Item

Packing List

Unit Price

Ordering

VECP Starter Kit
(Part No.: MYD-CZU3EG-4E4D-1200-C-ISP)

- One MYD-CZU3EG-ISP development board
(with active heatsink and image sensor)
- One 12V/2A Power Adapter
- One Mini USB Cable
- One 16GB TF Card
- One HDMI Cable
- One Product disk
(Including user manual, datasheet,
base board schematic in PDF format
and software packages)

USD599

MYD-CZU3EG-ISP Development Board
(Part No.: MYD-CZU3EG-4E4D-1200-C-ISP-S)

- One MYD-CZU3EG-ISP development board
(with active heatsink and image sensor)

Production recommended
Please inquire MYIR

Note:

We accept custom design based on the MYD-CZU3EG-ISP development board or customized image sensors or customized IP cores according to customers’ requirements. Please contact MYIR.







 

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