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MYIR Launches New SOM Based on Allwinner T527 Octa-core Processor

2023-12-29   10:0:56     Click: 106

Shenzhen, China – January 4, 2023 MYIR has launched the MYC-LT527 CPU Module, a cost-effective System-on-Module (SoM) that is equipped with the T527 (T527M / T527MN) AI platform SoC. This SoC delivers superior computing power with its Octa-core ARM Cortex-A55 CPU, up to 1.8GHz main frequency, and strong G57 MC1 GPU performance. For users with higher performance needs, the T527MN variant includes a 2 TOPS NPU, further enhancing AI computing capabilities. The MYC-LT527 CPU Module also performs well in hardware configuration. It integrates 2GB LPDDR4,8GB eMMC, 32Kbit EEPROM and power management IC (PMIC), and adopts 381-pin expansion interface design in LGA packaging, enabling the base board to carry the most I/O signals to and from the CPU module, providing users with more flexible and powerful scalability. Compact in size at only 45mm by 43mm, the MYC-LT527 Module is ready to run Android operation system and suitable for a range of application scenarios, including high-performance industrial robots, energy and power, medical equipment, display and controller machines, edge board AI boxes, vehicle terminals and other embedded devices that require media and AI functionalities.

MYC-LT527 CPU Module Top-view and Bottom-view

MYC-LT527 CPU Module (delivered with shielding cover installed by default)

Features Of MYC-LT527 CPU Module

- Dimensions: 45mm x 43mm

- PCB Layers: 12-layer design

- Power supply: 5V/3A

- Working temperature: -40~85 Celsius (industrial grade) or -20~70 Celsius (extended temperature)

- OS support: Android 13

- Allwinner T527 processor (T527M/T527MN)

- 2GB LPDDR4 (supports optional 1GB / 4GB LPDDR4)

- 16GB eMMC (supports optional 8GB / 32GB eMMC)

- 32Kbit EEPROM

- Power Management IC

- 381-pin LGA Expansion Interfaces


* 1 x PCIe2.1, RC mode (reused with USB3.1)

* 1 x USB 2.0 DRD

* 1 x USB 2.0 Host

* 1 x USB 3.1 DRD (reused with PCIe2.1)

* 2 x SDIO 3.0

* 10 x UART

* 2 x CAN

* 9 x I2C

* 30 x PWM

* 4 x SPI

* 24 x GPADC, 12-bit

* 2 x LRADC, 6-bit

* 1 x Parallel CSI, 16-bit

* 1 x HDMI 2.0

* 1 x eDP

* 2 x LVDS with dual link- 2 x RGB

* 4+4-lane, 4+2+2-lane, or 2+2+2+2-lane MIPI-CSI

* 2 x MIPI-DSI

* 2 x DACs and 3 x ADCs

* 3 x audio outputs

* 3 x audio inputs

* 4 x I2S/PCM

* 1 x SPIF I/O

* 2 x CIR RX and 1 x CIR TX

* Up to 138 x GPIO

MYC-LT527 CPU Module Block Diagram

MYIR offers the MYD-LT527 Development Board for evaluating the MYC-LT527 CPU Module. This board is assembled by soldering the MYC-LT527 CPU Module onto a base board, which serves as an expansion board tailor-made for using with the MYC-LT527 CPU Module. It is equipped with a comprehensive range of interfaces, including one USB3.0, two USB2.0, two Gigabit Ethernet, two CAN interfaces, a WiFi/Bluetooth module, a Micro SD card slot, an Audio interface, two Mini-CSI interfaces, and multiple display interfaces: HDMI, Mini-DP, MIPI-DSI and LVDS. It also features a 40-pin RPI-compatible expansion interface and a MYIR custom 40-pin expansion interface, MI Fans PI interface, for increased expandability. Additionally, MYIR offers optional MY-CAM003M Camera Module, MY-WIREDCOM RPI Module (RS232/RS485/CAN) and MY-LVDS070C LCD Module, which greatly enhance the functionality of the board.

MYD-LT527 Development Board Top-view

MYD-LT527 Development Board Bottom-view

MYD-LT527 Development Board (delivered with heatsink installed by default)

MYD-LT527 Development Board Block Diagram

MYIR provides three standard configurations for the MYC-LT527 CPU Module to meet the different needs of the customers. The modules are affordable and we also offer discounts for bulk purchases.

Part No.


RAM & Flash


Working Temp.

Unit Price





-40~85 Celsius




Not Support

-40~85 Celsius




Not Support

-20~70 Celsius


More information about the MYC-LT527 CPU Module can be found at:

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