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MYIR's NXP i.MX 93 SOM Debuts at 2024 NXP Industrial and IoT Technology Summit

 
2024-11-22   16:10:28     Click: 100
 



Shenzhen, China - October 11, 2024 - NXP has held the "NXP Industrial and IoT Technology Summit" in Beijing, providing a platform to explore technological advancements and foster future market growth. This summit focused on cutting-edge enabling technologies, covering hot applications such as smart industry, smart home, and healthcare sectors. MYIR, as a gold partner of NXP, attended the summit and showcased their latest products, including the NXP i.MX 93 based System-On-Module (SOM) MYC-LMX9X and development board MYD-LMX9X. The SOM, featuring a high-performance processor, integrated NPU, a variety of peripheral interfaces, and a compact size, attracted the attention of many customers.




The NXP i.MX 93 based SOM from MYIR has the following key features:


High-performance processor: The SOM is equipped with the NXP i.MX 9352 processor, featuring dual ARM Cortex-A55 cores clocked at up to 1.7GHz and Cortex-M33 cores running at 250MHz, capable of meeting the needs of multitasking processing and real-time requirements.


Integrated NPU: Equipped with a dedicated Neural Processing Unit (NPU) capable of 0.5 TOPS, enabling cost-effective and lightweight AI applications.


Rich peripheral interfaces: Supports a variety of peripheral interfaces, including 2x Gigabit Ethernet, 2x CAN FD, 2x USB 2.0, 8x UART, 8x I2C, 8x SPI, and 2x I3C, making it convenient for users to connect and expand in various ways.


Compact size: The SOM measures only 37mm×39mm, suitable for various compact industrial IoT devices. It can be applied in industries such as charging piles, energy and power, medical equipment, industrial HMI, motion controllers, and construction machinery.




At the Summit, MYIR not only showcased its new NXP series products but also engaged in in-depth exchanges with numerous industry partners. In the future, MYIR will continue to collaborate closely with these excellent partners to advance the development of the embedded industry and jointly promote smart manufacturing and digital transformation.



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